The DFN/QFN platform is multi-functional and enables one or more semiconductor devices to be connected within a lead-free package. Chip connection can be achieved by using wire bonding devices, such as the BSOB wire bonding process. The advantages lie in lower wire height and thinner package thickness.

SOT（Small Outline Transistor）Surface mount small power transistor package

After the chip surface mount of the camera module is completed, the electrical connection between the chip and the substrate needs to be achieved through wire bonding. The process of connecting the electrodes on the chip to the external pins with wires completes the current path between the chip and the external pins of the package.

SOP packaging (Small out-of-line Package, small form factor packaging) is a common surface mount packaging technology. The DVO advanced wire bonding machine can achieve precise connection between SOP packaged chips and multiple pins, with small solder joint errors and stable arc and height.

The main packaging technologies of camera modules include COB (Chip On Board), CSP(Chip Scale Package), and FC(Flip Chip), among which COB is currently the mainstream packaging method.