CSPT2024| Highlights Review

From September 24th to 26th,  the 22nd China Semiconductor Packaging and Testing Technology and Market Annual Conference was held at the Taihu  International Expo Center in Wuxi. The conference focused on semiconductor packaging and testing technology,  market and application, and carried out activities including theme forums,  technical seminars and product exhibitions. As a provider of packaging equipment and solutions supporting the  development of the semiconductor industry,  Devol Advanced showcased and shared its research and development achievements and solutions in wire bonding technology,  interacted and exchanged with many industry experts and enterprise representatives, learned from each other,  and jointly promoted the development of the industry. The performance and process capability of the wire bonding  machine, a packaging and testing equipment, are of great significance to chip manufacturing,  and the progress of its localization has attracted much attention. During the conference,  the core technology of wire bonding machines showcased by Devol Advanced attracted a large number of visitors to stop and  exchange ideas.

With the increasing demands of customers for image processing techniques, the company's Flick2 series of high-precision fully automatic wire bonding machines have undergone several years of iterative upgrades. The accuracy, stability, speed and operability of the equipment have all reached a higher level. Through independent innovation, the gap with international giants is gradually narrowing. The F2 series of high-precision fully automatic wire bonding machines have been delivered to the client for mass production. In the field of semiconductor packaging and testing equipment, Devol Advanced has a leading edge in independent innovation, with over 20 invention patents, more than 30 utility model patents, and 6 software Copyrights. The proportion of R&D talents exceeds half. In the future, the company will continue to pay close attention to market demands, enhance its technological innovation capabilities, and provide more advanced packaging and testing equipment and solutions for its clients.