Good News | Devol Advanced has been approved for funding as a key project of the "Challenge and Response" technology research and development program by the Shenzhen Science and Technology Innovation Commission

〖Guide〗

On March 2, 2022, the Shenzhen Science and Technology Innovation Commission officially issued a notice on the projects supported by the science and technology plan. The key technological breakthrough project "Key Technology Research and Development of High-speed and High-Precision Wire Bonding Machine for Semiconductor Chip Packaging 2021N091" (hereinafter referred to as the "Project") applied for by Devol Advanced has been exclusively approved for a research and development fund of tens of millions of yuan in the fierce competition.

〖What is a wire bonding machine?〗

Among all the links of semiconductor chip packaging, the wire bonding machine can be called the "crown" of packaging equipment. Wire bonding process refers to the process of connecting the chip pads to the substrate or lead frame using metal wires. It is the foundation for the chip to achieve electrical interconnection and information exchange, and is the most crucial step in the packaging process. From a technical perspective, high-speed and high-precision wire bonding machines have extremely strict requirements for precision machinery, electronic hardware, real-time software, motion control, machine vision and bonding processes. The research and development of these key technologies and the ultimate realization of domestic substitution of wire bonding machines are the inevitable paths for the independent development of China's semiconductor industry.

 〖Background introduction〗

In recent years, with the support of national policies, especially the implementation of major national science and technology projects, China's integrated circuit industry has achieved rapid development. With the development of the entire industry, the domestic packaging and testing market size has exceeded 250 billion yuan. At present, wire bonding holds a dominant position among all packaging bonding technologies, reaching 65%. It is the most challenging part in semiconductor packaging processes and must possess technical characteristics such as stability, high speed, and high precision to meet the increasingly evolving packaging requirements. This project research is conducive to narrowing the gap with the international advanced level and is of vital importance to the development of China's integrated circuit industry.

 〖Break through key technologies〗

Therefore, the advanced R&D team of Devol has been working in the field of IC packaging to tackle key foreign "bottleneck" technologies, and has been conducting research on the key technologies of high-speed and high-precision wire bonding machines. The main contents include the research on resonance control and dynamic characteristics of dual-frequency piezoelectric ultrasonic transducers, the optimization of bonding process parameters for various lead materials, the development of force and position control and vibration suppression control systems for the bond heads of lead bonding machines, the research on high-speed and high-precision motion platforms and control technologies, and the research on visual positioning and bonding defect detection algorithms for chip bonding. This project has a strong R&D team. The majority of the core members have been engaged in semiconductor equipment research for more than 15 years and possess solid technical foundations and R&D practical experience in the industry.

In terms of technology transfer, Devol Advanced successfully launched the Flick20 IC packaging fully automatic wire bonding machine with core technology and independent intellectual property rights in 2019. This effectively enhanced the wire bonding reliability of chips, achieving the goal of industry users to improve production efficiency and product yield, and reduce the production cost of related chips. Moreover, Devol Advanced attaches great importance to various process requirements raised by customers. Relying on the underlying independent technology, it can quickly provide corresponding process updates and services to meet and guarantee different terminal applications.

This time, it has received support from the Shenzhen Science and Technology Innovation Commission for the key project of the "Challenge and Response" technology research and development program in 2021, demonstrating the advanced R&D technology level of Devol.

Against the backdrop of the rapid development of the semiconductor industry, after ten years of market refinement, Dewo Advanced has been accelerating its growth and has become the preferred brand of domestic semiconductor wire bonding machines. In the future, Devol Advanced will fully leverage its own advantages and resources, increase investment in research and development, enhance its independent innovation capabilities, strengthen its core competitiveness, and contribute to the high-quality development of China's integrated circuit industry!