Devol Advanced has been awarded the Best Brand Award at the 2023-2024 China International Semiconductor Packaging and Testing Equipment Awards

On March 19th, the 2024 China International Semiconductor Packaging and Testing Conference and the "Best Brand Award" ceremony for Semiconductor Packaging and testing, hosted by Today Semiconductor, was successfully held in Shanghai. This conference, themed "Unite Strengths to Empower Domestic Production, Advanced Packaging and Testing to Create the Future of Chips", brought together representatives from outstanding enterprises in the semiconductor packaging and testing industry chain to discuss the cutting-edge and hot issues in semiconductor development.

The organizer announced and presented the "China International Semiconductor Packaging and Testing - Best Brand Award" on the spot, encouraging and recognizing enterprises that have achieved breakthroughs and possess strong market competitiveness in the semiconductor packaging and testing field. It awarded Devol Advanced the "2023-2024 China International Semiconductor Packaging and Testing Equipment - Best Brand Award".

In the chip packaging and testing stage, the wire bonding machine is the most crucial and core equipment, which requires high-speed and high-precision automated equipment to ensure the stability and reliability of the chip as well as the productivity of the production line. For many years, Devol Advanced has been dedicated to the field of semiconductor packaging and testing equipment, committed to providing innovative equipment and process solutions, and has achieved full coverage of packaging applications for semiconductor discrete devices, optoelectronic devices, sensor devices, and large-scale devices.

Devol Advanced attaches great importance to the scientific spirit and R&D innovation. More than half of its staff are R&D personnel. The key technology research and development of its independent wire bonding machine is a key project of the "Science and Technology Innovation Commission's Challenge and Response" technology breakthrough program in 2022, and has received high praise from the industry on multiple occasions. Relying on the core technology of independent intellectual property rights of wire bonding machines, Devol Advanced has integrated the entire chain from R&D, production, sales to technical support, and has become an innovation pioneer in the domestic packaging and testing equipment field.

Honor belongs to the past, and hard work shapes the future. Devol  Advanced will continue to carry forward the spirit of hard work, center on customer satisfaction, and forge ahead with the attitude of a striver!