CSPT2023| Highlights Review

As an annual professional packaging and testing event, the 21st China Semiconductor Packaging and Testing Technology and Market Annual Conference, guided by the China Semiconductor Industry Association and hosted by the Packaging and Testing Branch of the China Semiconductor Industry Association, was grandly held in Kunshan, Jiangsu Province on October 26-27 with the theme of "Dare to be Digital First, Plan for New Development of the Packaging and Testing Industry". More than 2,300 professional guests from the upstream and downstream of the industry were present at the scene, exchanging experiences around the latest technologies, cutting-edge products and market trends in semiconductor packaging.

During the conference, Devol Advanced showcased its core equipment in the semiconductor packaging and testing business field, the F2 series high-precision fully automatic wire bonding machine. Focusing on the difficulties in the packaging wire bonding process, it brought its independently developed innovative technology, providing feasible solutions for the packaging wire bonding process. On site, Devol's technical engineers answered questions for industry partners.

In recent years, Devol's advanced R&D direction has been closely aligned with customer demands. By consolidating the underlying technology and iterating the process technology on the basis of previous generations of equipment, significant progress has been made in the precision, stability, speed, and ease of operation of the equipment. It has gradually achieved a wider range of packaging and application of the equipment, taking the lead in the domestic wire bonding equipment market and earning recognition from many enterprises in the industry.

For 11 years, Devol Advanced has been deeply engaged in the domestic substitution of high-end semiconductor equipment. Based on independent innovation, it has built a high technological barrier and is committed to providing advanced and applicable packaging process technology equipment for the industry, contributing to the high-quality development of China's integrated circuit industry.