Highlights Review |elexcon2023 Shenzhen International Electronics Exhibition

From August 23rd to 25th, Devol Advanced made its appearance at elexcon2023 Shenzhen International Electronics Exhibition, showcasing its High F2 series high-precision fully automatic wire bonding machines on the wafer-level SiP advanced packaging production line. It comprehensively demonstrated the superior performance of Devol's wire bonding machines in chip interconnection, attracting many professional visitors to stop and exchange on site.

SiP is an important technical path to go beyond Moore's Law, with prominent advantages in design, cost and efficiency. More and more low-power, miniaturized and multi-functional integrated terminal electronic products choose SiP technology in production to enhance the performance of chips. The high-density integration technology of SiP poses higher challenges to the small-pitch solder joints and ultra-low line arc technologies in the wire bonding process. It requires equipment with higher precision and better stability to meet its process requirements. The Devol Advanced F2 series high-precision fully automatic wire bonding machine, based on 11 years of underlying technology accumulation, enhances the production capacity of the packaging production line through optimized processes and improved structural modules, as well as timely technical support services.