Devol Advanced made its debut at the 5th SEMI-e Shenzhen International Semiconductor Technology and Application Exhibition

From May 16th to 18th, the 5th SEMI-e Shenzhen International Semiconductor Technology and Application Exhibition was held at the Shenzhen International Convention and Exhibition Center (Bao 'an New Venue). With the theme of "Opportunities in Chips, Smart Future", this exhibition coordinated the semiconductor industry value chain and empowered a bright future with safety, intelligence and sustainability. Semiconductor professionals, entrepreneurs and scholars from all over the country gathered in Shenzhen to visit the exhibition. Dewo Advanced was invited to participate in the entire exhibition. At the exhibition site, the F1 and F2 series of high-precision fully automatic wire bonding machines and innovative process solutions were displayed. The three-day exhibition was brimming with technological power and was full of highlights.

High-precision and high-quality equipment is very difficult to manufacture. This is the voice of many professional visitors. Seeing the rapid progress of domestic wire bonding machines has greatly increased the confidence of the industry in achieving the goal of independent development of China's semiconductor wire bonding machines. Dewo Advanced was established in June 2012. From the very beginning, it set the goal of catching up with and surpassing the international giants in the industry. It is one of the earliest enterprises in China to independently develop wire bonding technology. To achieve a breakthrough from zero to one and take the lead among domestic peers in solving the long-standing "bottleneck" problem of domestic wire bonding machine technology, along with the rapid development of China's semiconductor industry in recent years, it has become a key force in domestic semiconductor packaging and testing equipment. Since the company launched the first generation of wire bonding machines in 2013, it has steadily achieved the transformation of key technological achievements in wire bonding machines, delivered batch orders of equipment, verified basic and innovative processes and received wide recognition from customers. Currently, it is in a leading position domestically and an advanced position internationally in terms of equipment and process technology. By participating in this exhibition and technical exchange, Dewo Advanced showcased its leading packaging technologies and solutions to the audience. At the same time, it also took this opportunity to establish communication and cooperative relationships with various outstanding peers, laying a foundation for improving its own level.