Redefining Technology |BEYOND Expo 2023 International Technology Innovation Expo

From May 10th to 12th, BEYOND Expo 2023 International Science and Technology Innovation Expo was successfully held at the Venetian Macao Convention and Exhibition Centre. As a representative enterprise of packaging and testing equipment in the integrated circuit field, Dewo Advanced was invited to participate in the exhibition. On the spot, it actively engaged in international cutting-edge technological innovation exchanges and promoted leading packaging and testing technologies.

At this expo, numerous innovative enterprises from around the world gathered to showcase their technological achievements and product advantages. About 600 exhibitors fully displayed the technological products of their three sub-brands: sustainable development, life sciences, and consumer technology. Many enterprises from the integrated circuit industry became a major highlight of this BEYOND Expo. The advanced high-precision wire bonding machine of Dewo has also attracted the interest of many experts, entrepreneurs and professional visitors.

Macao has globally leading innovative competitiveness in the field of integrated circuits. This time, participating in the BEYOND Expo Technology Expo in Macao and conducting exchanges through the Macao international platform, the advanced brand of Dewo connects with the international community, laying the foundation for its future promotion to the world stage.