Highlights of the 21st China International Conference on Talent Exchange

From April 15th to 16th, 2023, the 21st China International Conference on Talent Exchange was successfully held in Shenzhen, gathering global wisdom and illuminating the path of high-quality development with the light of innovation. This conference, themed "Promoting Scientific and Technological Innovation, Seeking Common Development, and Benefiting Global Talents", adopts a new "dual-engine" exhibition model both offline and online. Offline, it features five major sections: the opening ceremony, Shenzhen Forum, exhibition and negotiation, talent recruitment, and thematic activities. Online, it offers functional service areas such as virtual exhibition halls, project matching (EO system), and online recruitment. A total of 60 forums and activities will be held. It attracted 948 professional institutions and organizations from 28 countries and regions, as well as nearly 10,000 government representatives, experts, scholars and high-end talents from home and abroad to participate on site.

At the entrance of Bao 'an Exhibition Hall, the IC series of high-precision wire bonding machines exhibited by Devol Advanced attracted many visitors to stop and watch. Through videos and technical explanations, the functions and applications of the wire bonding machines were demonstrated, fully highlighting the characteristics of high-precision equipment and showcasing Devol's innovative strength.

On the opening day of the conference, Wang Lide, the district head of Bao 'an District People's Government, and his team conducted an on-site visit and inspection of the exhibition hall. They came to the exhibition area of key institutions and representatives of technology enterprises in Bao 'an District to visit and learn about the wire bonding machine independently developed and produced by Dewo Advanced.

Devol Advanced is a national high-tech enterprise and a specialized, refined, distinctive and innovative enterprise in Shenzhen. It is the leading unit of the key technology research and development project of high-speed and high-precision wire bonding machines for semiconductor chip packaging in Shenzhen, shouldering the responsibility of breaking through the "bottleneck" of core semiconductor equipment in China. At present, it holds over 40 core independent intellectual property patents. Behind the innovative achievements lies a powerful R&D team. Currently, the proportion of R&D personnel exceeds 50%, and the majority of the core backbone members have been engaged in semiconductor equipment research for more than 15 years, possessing solid industry technical foundations and R&D practical experience. Talents are the core of innovative development. Devol Advanced attaches great importance to talent recruitment and cultivation. The company adheres to the talent concept that "the goal of human capital appreciation takes priority over that of financial capital appreciation", and will create a better talent development platform to attract and retain talents, making Devol Advanced an ideal platform where talents flock in.