Won the Best Brand Award for Semiconductor Packaging and Testing Equipment in 2022-2023

On March 20th, the 2023 China International Semiconductor Packaging and Testing Conference and the "Annual Best Brand Award" ceremony of Packaging and testing, hosted by Today Semiconductor, was grandly held in Pudong, Shanghai. Devol Advanced, as a supplier of packaging and testing equipment, was invited to attend this conference. At the meeting, Today Semiconductor announced the "Best Brand Award for Semiconductor Packaging and Testing in China 2022-2023". Devol Advanced, with its outstanding innovation capabilities, has achieved remarkable results in promoting the localization of packaging and testing equipment, standing out among domestic packaging and testing enterprises and winning the "Best Brand Award for Semiconductor Packaging and Testing Equipment 2022-2023". This high recognition within the industry is a reflection of Devol's advanced innovation capabilities and market competitiveness, indicating that Devol's advanced domestic influence is continuously increasing. More than 300 elites from the packaging and testing industry gathered at the conference site to witness the glorious moment of the "Annual Best Brand Award" ceremony together.

High-precision fully automatic wire bonding machines are an important part of the semiconductor packaging and testing end. To ensure the quality of core process technology for customers, Devol Advanced has launched a product matrix of three series. Among them, Series 1 is an application product of optoelectronic devices, suitable for packaging forms such as white light, display, RGB, and IC color. The IC application products of Series 2 and Series 3 are discrete devices, sensor devices, and large-scale devices, which can be applied to various packaging forms such as SOT, SOP, MEMS, DFN, QFN, and SiP. Each device meets the market segmentation demands through a product matrix. Coupled with continuous innovation in processes and new technologies, the stability, consistency, and efficiency of the devices have been significantly enhanced. Build up the increasingly strong market competitiveness of Devol Advanced.

Nowadays, the global semiconductor market landscape has undergone tremendous changes. In the turbulent environment of the semiconductor competition between China and the United States and the sluggish demand for semiconductors, domestic wire bonding machine equipment needs to continuously lead the industry in product innovation and process breakthroughs to break through the competition. In the future, Devol Advanced will create more advanced processes and more stable equipment, provide reliable technical support, and promote the high-quality development of domestic substitution in packaging and testing equipment.