Devol Advanced was invited to attend the 2022 China Semiconductor Packaging and Testing Technology and Market Annual Conference

Be proactive and enterprising, forge ahead with determination, and jointly create a new era for the packaging and testing industry! The 20th China Semiconductor Packaging and Testing Technology and Market Annual Conference (CSPT2022) was grandly held at the International Conference Center in Nantong City, Jiangsu Province on November 15-16, 2022. During the annual meeting, government leaders, renowned experts, scholars and entrepreneurs in the industry gathered together to share experiences, exchange views and jointly explore the policies and development directions of China's semiconductor industry.

Shenzhen Devol Advanced Automation Co., Ltd. was invited to attend. The company's team was present throughout the event to promote the high-precision fully automatic wire bonding machine. Through in-depth exchanges with industry leaders, experts and customer representatives, Devol Advanced's innovative high-end equipment technology and efficient professional service model received high attention from the attending representatives.

Devol Advanced was established in 2012. It has been committed to innovation and has continuously delved into the high-end semiconductor packaging equipment market. It has now developed into a leading provider of semiconductor packaging equipment and solutions in China. At present, to ensure the security of the semiconductor industry supply chain, with the transfer of the integrated circuit industry to the Chinese mainland and the vigorous support of the government, the development space for the semiconductor packaging industry is huge.

The domestic substitution of semiconductor wire bonding machine equipment is in line with the trend. Devol Advanced will seize the opportunity, actively expand the market, continuously improve packaging process technology, optimize equipment performance, and enhance service levels, contributing to the "Chinese chip".