Good News | Devol has been successfully included in the list of "Specialized, Refined, Unique and Innovative" enterprises in Shenzhen for 2021

On June 15th, the Shenzhen Municipal Bureau of Industry and Information Technology announced the list of "Specialized, Refined, Unique and Innovative" small and medium-sized enterprises in Shenzhen for 2021. Shenzhen Devol Advanced Automation Co., LTD. (hereinafter referred to as Devol Advanced) was successfully selected after multiple rounds of review, thanks to its advantages in product research and development and professional innovation in the field of semiconductor packaging equipment.

What is a specialized, refined, distinctive and innovative enterprise

According to the definition of the Ministry of Industry and Information Technology, "specialized, refined, distinctive and innovative" enterprises refer to small and medium-sized industrial enterprises with the characteristics of "specialization, refinement, distinctiveness and innovation". Specialized, refined, distinctive and innovative enterprises focus on key technologies and promote product and technological innovation. They are a crucial link in enhancing the stability and competitiveness of industrial and supply chains and an important support for promoting the resilient development of China's economy. Actively supporting the development of specialized, refined, distinctive and innovative enterprises plays an important role in promoting China's economic development. The selection of Devol Advanced as a "Specialized, Refined, Unique and Innovative" enterprise in Shenzhen in 2021 is a high recognition of Devol Advanced's professional level and innovation capabilities.

Unswervingly pursue independent innovation and forge a path of domestic substitution

As a leading domestic provider of semiconductor packaging equipment and solutions, Devol Advanced has been dedicated to the research and development and production of wire bonding machines in the semiconductor packaging process for over a decade. It has created high-precision wire bonding machines for semiconductor IC and LED packaging and has overcome five core technologies: precision mechanics, precision electronics, real-time software, motion control, and machine vision. And on this basis, an extremely strict bonding process is constructed to enable the equipment to operate stably and efficiently in the chip wire soldering process. Devol Advanced fully utilizes the resources of the upstream and downstream of the semiconductor industry chain, seizes development opportunities, and has established an advantage in the field of semiconductor equipment, empowering domestic chip manufacturing.

Looking up at the starry sky with lofty aspirations, there is no doubt that in its technological strategic layout, Devol Advanced aims at the advanced technologies of international leading companies with the goal of surpassing the industry's strongest. In June 2012, it established a research and development center. The team has made arduous efforts and heavy investments in key technologies. Over the past ten years, it has continuously enhanced its technological barriers and accumulated more than 30 core independent intellectual property patents. We have achieved large-scale production and industrial upgrading of high-precision wire bonding machines. Relying on the advantages of stable, precise, high-speed and simple products, we have broken through in the fierce market competition of foreign brands.

In the future, Devol Advanced will unswervingly follow the independent innovation model, fully leverage its own advantages and resources to increase investment in research and development, take solid steps on the road of domestic substitution of semiconductor equipment, and contribute to the high-quality development of China's integrated circuit industry!