Application of copper wire bonding technology in wire bonder

Wire Bonding is a kind of thin metal wire, the use of heat, pressure, ultrasonic energy to make the metal lead and the substrate pad tight welding, to achieve the electrical interconnection between the chip and the substrate and the information between the chip. Under ideal control conditions, electron sharing or atom diffusion will occur between the lead and the substrate, so that the bonding between the two metals can be achieved on the atomic scale. Commonly used wire are gold wire, alloy wire, silver wire, copper wire. Copper wire is being used in microelectronic packaging for its excellent mechanical properties, electrical properties and low cost factors.