Accelerate domestic production and firmly stand at the forefront of packaging and testing equipment

In the process of display chip packaging and testing manufacturing, the high-precision fully automatic wire bonding machine mainly uses ultrasonic energy to tightly bond the metal wires with the substrate pads. This technology is particularly important for the quality of chip packaging. For a long time, the market for wire bonding machine equipment has been dominated by foreign manufacturers such as K&S, ASM, KAIJO, and SHINKAWA. In recent years, driven by the explosive growth in market demand and the trend of domestic substitution, domestic wire bonding machine equipment manufacturers have seized the opportunity. Shenzhen Dewo Advanced Automation Co., LTD. (hereinafter referred to as Dewo Advanced) was the first to break through the key "bottleneck" technologies of wire bonding machines, organically integrating multi-disciplinary technologies such as "precision mechanics, electronic hardware, real-time software, motion control, and machine vision" with bonding processes, and widely applying them in various packaging forms in the LED and IC fields.

Focusing on the performance upgrade of equipment, in line with the continuously rising requirements of packaging plants and the innovative evolution of materials and processes, Dewo's advanced new equipment and process solutions are also being introduced to the market. In 2022, the new LED high-precision fully automatic wire bonding machine Flick13 was launched, achieving significant improvements in UPH, MTBA, and yield rate. The high-precision fully automatic wire bonding machine is equipped with a new type of high-speed recognition device. The easy-to-operate image pre-detection function brings high productivity. When welding the current component, the camera detects the next component. The low-vibration controllable vibration XY platform and the low-inertia high-speed welding head can improve the quality of the welding wire and the high-speed welding wire function. The advanced closed-loop motion control system enhances the stability and speed of the stringing. To facilitate the operation of technicians, simplify the line arc parameter file and keep the operation interface simple, which is helpful for improving production efficiency. To support the upgrading of the process, a rich line arc library is provided, allowing for the programming of various line arcs, such as spatial folded line arcs, ultra-low line arcs, etc. Meet the process requirements of various packaging forms such as white light, display, RGB, and IC color.

The innovative strength has been repeatedly recognized In 2022, the global optoelectronic display industry emerged from a trough and is expected to experience weak growth in 2023. The road to recovery will not be smooth. As a supporting force in packaging processes, high-precision fully automatic wire bonding machines can only capture the market through innovation. Devol Advanced actively invests in the research and development of new equipment and new processes. Currently, it has accumulated over 40 core patents and has been recognized as a national high-tech enterprise and a specialized and specialized enterprise in Shenzhen. Continuous breakthroughs have been made in the key technology of wire bonding. With its leading key technology of wire bonding, it has been recognized by the government and won the key project of the "Challenge and Response" technology research and development program of the Shenzhen Science and Technology Innovation Commission at one stroke. Its innovation strength is ahead of domestic peers.

Localization is on the way The current market competition is becoming increasingly fierce. Packaging manufacturers hope to enhance their benefits by implementing cost reduction and efficiency improvement measures, and the domestic production rate of purchased equipment has significantly increased. One of the main goals of Devol  Advanced for the future is to increase the import substitution rate of high-precision fully automatic wire bonding machines, continuously extend along the path of autonomy, and achieve a further upgrade in the domestic production rate of components while maintaining the same product quality and performance.

Standing at the forefront of the trend and prioritizing innovation, Dewo Advanced has been able to firmly establish itself in the high-end packaging and testing equipment market, which is not achieved overnight. It lies in the strong support provided by ten years of technological accumulation for its development. It is not easy to achieve domestic substitution. Dewo Advanced has won wide recognition from customers with stable equipment, reliable processes and professional technical support. Against the backdrop of already achieving technological breakthroughs and market-driven forces, it is expected to further continuously enhance the influence of domestic high-end packaging and testing equipment.