Devol Advanced made its appearance at the 6th China System Level Packaging Conference, showcasing its advanced wafer-level SiP production line-News-Shenzhen Devol Advanced Automation ,Inc.-EN

The 6th China System Level Packaging Conference and Exhibition, which lasted for three days, came to an end at the Shenzhen Futian Convention and Exhibition Center on November 8, 2022. As one of the major events in the semiconductor industry, this year's event features four core exhibition themes: "Automotive-grade chips and components + Embedded Systems and AIoT + SiP and advanced packaging and testing + domestic components". Over 400 brands have gathered, attracting a large number of visitors to observe and exchange.

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Devol Advanced was invited to showcase its IC series of high-precision fully automatic wire bonding machines at the wafer-level SiP advanced production line. With the form of "professional explanation + equipment demonstration", it fully enhanced the display effect and became a star booth in the equipment display area. During the forum, an advanced process R&D engineer from Devol shared the wire bonding process in the front end of semiconductor packaging. Focusing on the principle of wire bonding and common application problems and challenges, they proposed referenceable solutions.

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Devol Advanced's IC series wire bonding machines on display this time can support the bonding and packaging process of wafer-level SiP solutions, meeting the technical requirements of high UPH, high precision and high reliability for interconnection.

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Features:

The IC series high-precision fully automatic wire bonding machine adopts thermal ultrasonic technology and is suitable for various wirematerials such as gold wire, copper wire, silver wire, palladium-plated copper wire, gold palladium-copper wire, and alloy wire. The new high-speed recognition device equipped has multiple graphic recognition functions, image recognition accuracy up to ±0.3μm@3sigma; The adoption of a low-vibration controllable vibrating XY platform and a low-inertia high-speed welding head makes the welding more stable. Supports programming functions for complex wire welding programs and features the industry's most comprehensive arc library, such as spatial zigzags and ultra-low arcs. It is applicable to various packaging forms such as SOT/SOP/MEMS/DFN/SiP.

Wafer-level SiP solution

Wafer-level SiP solutions are methods of bundling multiple integrated circuits and passive components into a single package, where they work together within that single package. This package is connected by internal wiring, which links all the chips together to form a functional system. Wire bonding can be used as a packaging technology for SiP solutions.

SiP technology has a series of unique technical advantages, but it also faces many difficulties. As a packaging equipment manufacturer, Devol needs to deal with the continuous requirements for packaging process upgrades and the important challenges of yield and efficiency, and adapt to future market demands. In the future, Dewo Advanced will fully leverage its independent innovation advantages to provide support for the SiP technology packaging process, facilitate the development of SiP, and promote the improvement of semiconductor integration.