9 years of precipitation and ingenuity manufacturing

Introduction

Among them, the global packaging equipment market accounted for $5.7 billion (37 billion yuan), and the Chinese mainland packaging equipment market was about $1.7 billion (11.1 billion yuan).

The lead bonding process is the most critical step in the sealing process. The global market for wire bonding equipment is $1.9 billion (12.3 billion yuan), and the Chinese mainland market for wire bonding equipment is $570 million (nearly 4 billion yuan). Lead bonding equipment accounts for about one-third of semiconductor packaging equipment investment.

Driven by the demand for digital economy, 5G, and automotive electronics, as well as the impact of the global epidemic, production orders have accelerated to domestic transfer. The leading enterprises in the domestic closed test industry have full orders and tight production capacity. Closed test orders overflow and flow to small and medium-sized enterprises with large capacity expansion flexibility. Resulting in an increase in the demand for sealing and testing equipment in the industry. For the leading enterprises in the industry, whether due to cost considerations, or the supply chain security problem of the core equipment "jam neck", it will increase its demand for domestic equipment. Small and medium-sized enterprises are subject to greater cost pressure, and prefer domestic equipment with good performance, cost-effective and good service. Leading and small and medium-sized enterprises are facing the demand for localization, and local equipment welcomes alternative opportunities.

About DAA

Today, please follow Xiaobao into Shenzhen Devol Advanced Automation Co., LTD. (DAA), an excellent enterprise of lead bonding equipment in China, and communicate with Mr. Cheng Wei, general manager of Devo, to explore new ideas for the localization of lead bonding equipment.

DAA is a national high-tech enterprise focusing on independent research and development, production and sales of semiconductor manufacturing core equipment and solutions. We provide core equipment and solutions for customers in the fields of LED lighting, display packaging and IC semiconductor packaging.

The high-end equipment manufacturing industry is a strategic industry that provides high-end technology and equipment for national economic development and national defense construction. It is a high-end part of the equipment manufacturing industry with outstanding characteristics such as technology-intensive, high added value, large growth space and strong driving role.

In 2011, the state proposed that high-end equipment manufacturing is one of the important industries in the "Twelfth Five-Year Plan", and the development of high-end equipment manufacturing is an important way to build a powerful equipment manufacturing country and promote industrial transformation and upgrading. It is in this context that Devo was established, the spirit of Devo: virtue is the world, fertile land; With virtue as the product, with waugh peer.

Since its establishment 10 years ago, Devol has obtained 34 patents (20 inventions) and 4 software Copyrights. In the core technology field necessary for high-precision equipment, Devo has independently developed the trajectory ultra-high-speed synchronous motion control system, independent vision algorithm, ultra-high-speed motor and drive algorithm, precision ultrasonic ignition system and high-speed synchronous coordination algorithm between systems, and all core technologies have reached the international advanced level. Devol self-developed automatic high-speed gold wire machine in the welding speed, accuracy, stability can be comparable to the world's first-class enterprises.

Devol's excellent results are inseparable from its emphasis on R&D investment and scientific R&D management. The essence of R&D competition is R&D talent competition, and Devo R&D technicians account for more than 50%. R&d investment accounted for 20% of revenue. Devo has a comprehensive instrument configuration, with machining/simulation/testing, verification of the whole process capabilities.

The idea of DAA

Mr. Xiong Liwen, Chairman of Devo, graduated from Harbin Institute of Technology with a master's degree in micromotors and engaged in scientific research in Harbin Institute of Technology, and then worked for Huawei Electric; He is the co-founder of Huichuan Technology, the head of frequency converter technology, and the general head of servo product line technology. Mr. Xiong Liwen was born in Huawei, so that Devo inherited Huawei's excellent R & D management gene. Huawei's "customer-centric philosophy" is embedded in Devo's corporate DNA. Devo has a solid accumulation and has 9 years of R&D technology precipitation. Focus on R & D precipitation while continuing to pursue excellent quality. Lean production management, TQM total quality management, strict quality testing. Devo's customer service includes hardware services and technical support.

The so-called Devo, is to take virtue as the quality, and walk with Vo. Devo always believes that the future of high-tech equipment Chinese people to master their own core competitiveness. Devo's goal is to become the world's leading semiconductor manufacturing equipment and solutions leader, let the world feel the beauty of Devo technology.

Leading semiconductor manufacturing core equipment and solutions

Mr. Cheng Wei has been deeply engaged in the industry for many years, and concluded that the excellent technical performance of the lead bonding machine is only the basis for entering the industry. How to use the improvement of packaging technology to help consumer electronics achieve rapid innovation and iteration is the key to the future. The lead bonding machine has high technical barriers, and integrates control, machinery, vision and other interdisciplinary disciplines, which is the industrial machinery and equipment with the highest comprehensive requirements for precision and speed.

Devol's line of lead bonders mainly includes Flick10, Flick12 and Flick20.

Devol ultra-small chip solutions, as well as polycrystalline series solutions, provide technical support for packaged and combined innovation.

1. Solve the problem of ultra-small electrodes

2. Devol polycrystalline series solution to solve the problem of visual identification

3. Ultra-low flat arc

4. Chip interconnection problem BSOB currently Devo third generation Flick20, product integration equipment, process and services, directly after the packaging industry chain core, welding wire speed, precision, stability close to the world's first-class enterprises.

Future electronic market size

The size of the consumer electronics market in 2021-2025 is forecast to grow at a CAGR of 2.64%, and its market size will reach $1.16 trillion.

It is not difficult to see that the consumer goods market is huge, but it is approaching saturation and the growth rate is slowing down. The life cycle of consumer electronics products shows a trend of rapid creation and growth, and continuous rapid iteration.