In the era of "Internet of Everything", we must first solve the problem of "perception". As the "eyes, ears, mouth, nose" of the information age, sensors collect information from the outside world. However, on the one hand, China's sensor market is growing rap
MEMS sensors, or Microelectro Mechanical Systems, are multidisciplinary and cutting-edge research fields developed on the basis of microelectronic technology. After more than 40 years of development, it has become one of the major scientific and technological fields that have attracted the attention
1 IntroductionMEMS as the forefront of high-tech in the 21st century, in the industrialization of the road has been developed for more than 20 years, today, MEMS products because of its mass production, low cost and high performance and other characteristics, has a large market, most of the early pa
Wire Bonding is a kind of thin metal wire, the use of heat, pressure, ultrasonic energy to make the metal lead and the substrate pad tight welding, to achieve the electrical interconnection between the chip and the substrate and the information between the chip. Under ideal control conditions, elect
The "Independent Innovation, Digital Intelligence Empowerment -2023 Deloitte Shenzhen High Tech High Growth 20 and Rising Stars" list selection announcement and award ceremony, jointly hosted by Deloitte China and the Shenzhen Chamber of Commerce, was successfully held in Nanshan District,
11-29
2023
〖Guide〗On March 2, 2022, the Shenzhen Science and Technology Innovation Commission officially issued a notice on the projects supported by the science and technology plan. The key technological breakthrough project "Key Technology Research and Development of High-speed and High-Precision Wire
04-15
2022
From September 24th to 26th, the 22nd China Semiconductor Packaging and Testing Technology and Market Annual Conference was held at the Taihu International Expo Center in Wuxi. The conference focused on semiconductor packaging and testing technology, market and application, and car
10-09
2024
On March 19th, the 2024 China International Semiconductor Packaging and Testing Conference and the "Best Brand Award" ceremony for Semiconductor Packaging and testing, hosted by Today Semiconductor, was successfully held in Shanghai. This conference, themed "Unite Strengths to Empower
03-20
2024
On the evening of December 8th, the 2023 GAogong LED 15th Anniversary Celebration and Gaogong Golden Globe Awards Ceremony, with the theme of "Micro-Changes and Re-shining", was successfully held in Shenzhen. Over a hundred outstanding enterprise representatives from the upstream and downs
12-12
2023
As an annual professional packaging and testing event, the 21st China Semiconductor Packaging and Testing Technology and Market Annual Conference, guided by the China Semiconductor Industry Association and hosted by the Packaging and Testing Branch of the China Semiconductor Industry Association, wa
11-01
2023
From August 23rd to 25th, Devol Advanced made its appearance at elexcon2023 Shenzhen International Electronics Exhibition, showcasing its High F2 series high-precision fully automatic wire bonding machines on the wafer-level SiP advanced packaging production line. It comprehensively demonstrated the
08-31
2023
On the evening of June 28th, the 2023 TOP50 Display Industry Awards Ceremony, hosted by GGLED, was grandly held. Representatives and guests from the upstream and downstream of the display industry jointly announced the "2023 TOP50 Display Industry" list, covering outstanding enterprises in
06-28
2023
On the evening of June 9th, the 10th China LED Innovation Award Ceremony, hosted by the Semiconductor Lighting Technology and Application Professional Committee of the China Illuminating Engineering Society, was successfully held at the Langham Hotel South China in Guangzhou. That night, Devol Advan
06-19
2023
