In the era of "Internet of Everything", we must first solve the problem of "perception". As the "eyes, ears, mouth, nose" of the information age, sensors collect information from the outside world. However, on the one hand, China's sensor market is growing rap
MEMS sensors, or Microelectro Mechanical Systems, are multidisciplinary and cutting-edge research fields developed on the basis of microelectronic technology. After more than 40 years of development, it has become one of the major scientific and technological fields that have attracted the attention
1 IntroductionMEMS as the forefront of high-tech in the 21st century, in the industrialization of the road has been developed for more than 20 years, today, MEMS products because of its mass production, low cost and high performance and other characteristics, has a large market, most of the early pa
Wire Bonding is a kind of thin metal wire, the use of heat, pressure, ultrasonic energy to make the metal lead and the substrate pad tight welding, to achieve the electrical interconnection between the chip and the substrate and the information between the chip. Under ideal control conditions, elect
From May 10th to 12th, BEYOND Expo 2023 International Science and Technology Innovation Expo was successfully held at the Venetian Macao Convention and Exhibition Centre. As a representative enterprise of packaging and testing equipment in the integrated circuit field, Dewo Advanced was invited to p
05-22
2023
From April 15th to 16th, 2023, the 21st China International Conference on Talent Exchange was successfully held in Shenzhen, gathering global wisdom and illuminating the path of high-quality development with the light of innovation. This conference, themed "Promoting Scientific and Technologica
04-17
2023
On March 20th, the 2023 China International Semiconductor Packaging and Testing Conference and the "Annual Best Brand Award" ceremony of Packaging and testing, hosted by Today Semiconductor, was grandly held in Pudong, Shanghai. Devol Advanced, as a supplier of packaging and testing equipm
03-21
2023
The Guangdong-Hong Kong-Macao Greater Bay Area Industrial Integration and Innovative Development Summit Forum and the Second "Industrial Integration (Guangdong-Hong Kong-Macao Greater Bay Area) Innovation Award Ceremony", hosted by the Shenzhen Innovation Industry Integration Promotion Ass
03-14
2023
To meet the company's development strategy, further enhance its competitiveness and expand the talent pool of Devol, on February 8th, the first class of Devol Advanced in the spring was successfully launched. Vice President Zhang Weijiang, co-founder of Inovance Technology and executive presiden
02-10
2023
MLED, with its smaller size, tighter arrangement of LED beads, higher pixel density, and advantages such as higher brightness, wide color gamut, high contrast, low power consumption and long lifespan, is regarded as a new product for the upgrade of LED display technology following LED small-pitch di
01-29
2023
In the process of display chip packaging and testing manufacturing, the high-precision fully automatic wire bonding machine mainly uses ultrasonic energy to tightly bond the metal wires with the substrate pads. This technology is particularly important for the quality of chip packaging. For a long t
01-29
2023
Be proactive and enterprising, forge ahead with determination, and jointly create a new era for the packaging and testing industry! The 20th China Semiconductor Packaging and Testing Technology and Market Annual Conference (CSPT2022) was grandly held at the International Conference Center in Nantong
12-02
2022
From November 24th to 25th, 2022, the 2022 GAogong LED Display Annual Conference and Gaogong Golden Globe Awards Ceremony were grandly held at the Hyatt Regency Shenzhen Airport!On the afternoon of the 24th, at the intelligent manufacturing and materials special event sponsored by Devol Advanced, th
12-02
2022
The 6th China System Level Packaging Conference and Exhibition, which lasted for three days, came to an end at the Shenzhen Futian Convention and Exhibition Center on November 8, 2022. As one of the major events in the semiconductor industry, this year's event features four core exhibition theme
11-11
2022
